Industry-leading welding performance: maximum laser pull strength, minimal heat-affected zone, and low deformation during welding

Broad welding process compatibility: supports MBB and 0BB, printed silver grids and plated coatings, copper and aluminum ribbon; OBB also supports both flat and round ribbon types

Highly compatible automation line: enables fast switching among all module formats, accommodating changes in cell size, layout, ribbon specs, module structure, and assembly process

High yield across the entire line: equipped with single-cell PL, full-panel PL, 7-camera AOI, post-weld EL inspection, and fully automated repair for virtual solder and microcracks — ensuring zero microcrack, zero false weld, and zero short circuit

High system uptime: modular quick-swap design, auto ribbon feed & ultrasonic cleaning, independent-side operation during faults, enhancing operational efficiency and automation level

Strong scalability: optimized for thin-wafer processing, enables reduction of string spacing from 2 mm to 0.7 mm, increasing power generation area by 0.5%; supports optional upgrades for all-black modules, stacked negative-spacing layouts, and hidden busbar architectures