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    Product laser

    Products
    Laser Micro-Etching System
    Product Introduction
    This system adopts DR Laser’s proprietary optical homogenization technology to perform large-area, high-precision, and uniform laser etching on various tunnel oxide passivation layers. It is widely used in the patterning of high-efficiency back-contact (XBC) solar cells, offering a superior alternative to traditional photolithography and accelerating the industrialization of low-cost back-contact cell technologies.
    Product Features

    Ultrafast laser processing system combined with F-theta beam shaping and homogenization, enabling non-destructive ablation of oxide and passivation films

    Customizable square beam spot sizes tailored to specific process requirements

    Fine-pattern control technology ensures precise separation between P/N regions

    In-house developed high-precision vision algorithms for accurate alignment

    High throughput, high precision, high uniformity, and high stability

    Multiple in-line inspection functions to ensure superior product yield

    Modular design with strong compatibility and customizable configurations


    Field of application
    XBC and TOPCon solar cell manufacturing
    Technical indicators
    Specification
    Details
    Equipment Dimensions (L×W×H)
    6000 mm × 4000 mm × 2200 mm
    Compatible Wafer Size
    182 to 230 mm, supports various rectangular formats
    Wafer Thickness Range
    100 to 180 μm
    Loading/Unloading Mode
    AGV dual-layer dual-track system
    Cassette Capacity
    5×2 + 1 + 1
    Throughput
    ≥ 4000 pcs/h @ 182 mm × 182 mm