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    Mini/Micro LED Laser Soldering System
    
            
    Product Introduction
    
            
    DR Laser’s LumaFusion combines laser-assisted selective soldering technology with precision mechanical contact to create strong, reliable bonds between micro-scale components and temperature-sensitive substrates.
    
          
          
          
        
    
        
    
      
    
      
    
          
    
            
      
              
                  
                
              
                  
                
              
                  
                
              
            
    
          
    
          
              
    
                
    Product Features
    
                
    
                  
    
	Selective, High-Precision Laser Soldering

    

    
	Fully Automated Handling

    

    
	Integrated Vision Alignment System

    

    
	Contact Force Feedback and Parallelism Control

    

    
	Flexible Process Customization

    

    
	
    

    
                
    
              
    
            
          
              
    
                
    Field of application
    
                
    
                  Mini/Micro LED manufacturing
                
    
              
    
            
          
              
    
                
    Technical indicators
    
                
    
                  
    
	
		
    
			
				Specification
    
			    		
			
				Details
    
			    		
		
    
		
    
			
				Soldering Method
    
			    		
			
				Selective Contact Laser Soldering
    
			    		
		
    
		
    
			
				Laser Energy Control
    
			    		
			
				Programmable pulse energy for selective and uniform transfer
    
			    		
		
    
		
    
			
				Process Area (Laser Soldering)
    
			    		
			
				≤ 100 x 100 mm
    
			    		
		
    
		
    
			
				Carrier Size Support
    
			    		
			
				≤ 200 x 200 mm
    
			    		
		
    
		
    
			
				Substrate Size Support
    
			    		
			
				Support up to G2.5
    
			    		
		
    
		
    
			
				Vision System
    
			    		
			
				Integrated Coaxial Alignment + Large FOV Pre-Alignment
    
			    		
		
    
		
    
			
				Alignment Accuracy *
    
			    		
			
				±0.2 μm @ 3 σ
    
			    		
		
    
		
    
			
				Contact Force Monitoring
    
			    		
			
				Configurable with ±0.1% linearity and real-time force feedback
    
			    		
		
    
		
    
			
				Parallelism Control Tolerance
    
			    		
			
				±5 μm across bonding surface
    
			    		
		
    
		
    
			
				Automation Features
    
			    		
			
				Full auto-loading/unloading, fiducial recognition, alignment sequencing
    
			    		
		
    
		
    
			
				Production Scalability
    
			    		
			
				Supports R&D, NPI, and mass production lines
    
			    		
		
    
		
    
			
				*Carrier to substrate alignment, by high contrast chrome mask pattern